Heat Flow Meter

Overview

The High and Low Temperature Shock Airflow System is designed for reliability testing in a wide range of industries, including microelectronics, semiconductor components, and optical communications. This system simulates the temperature changes and shock conditions that electronic devices undergo in harsh environments. It is used for testing the adaptability and safety of devices such as chips, integrated circuits (SOC, FPGA, MCU), memory modules (Flash, UFS, eMMC), sensors, and aerospace materials. This system is particularly valuable for failure analysis, product screening, and environmental adaptability tests for research and production units.

With an effective temperature range from -80°C to +225°C, this system ensures precise and stable temperature conditions for various electronic devices. It also features a compact, mobile design for ease of use in different laboratory settings.

Features

• Wide Temperature Range: Capable of simulating extreme temperature changes from -80°C to +225°C, offering versatile testing conditions for various components.

• Compact & Portable: The system features a space-saving, mobile design, making it easy to move and operate in various lab environments.

• Touchscreen Interface: Equipped with a user-friendly touchscreen interface for easy operation and control of test parameters.

• Quick Stabilization: Fast temperature stabilization for DUT (Device Under Test), ensuring efficient testing processes.

• High Precision Temperature Control: Maintains a temperature accuracy of ±1°C, with display accuracy up to ±0.1°C for reliable testing.

• High Airflow Capacity: Capable of delivering airflow up to 18 SCFM, providing rapid and consistent temperature change rates.

• Frost Removal Design: Integrated defrost function to quickly eliminate moisture accumulation inside the system, ensuring optimal performance.